Device: 3DFN4G08VS1274 [SOP50] (MMFN08512801S-D)
Manufacturer: 3D Plus
Part number description for this device:
Move the cursor over the box to highlight particular section| 3D | 3D Plus Module | |
| XX | Module Type | DP = DPRAM EE = EEPROM FN = Flash NAND FO = Flash NOR FR = FRAM MR = MRAM PO = PROM SF = StrataFlash SD = Synchronous RAM SR = Static RAM 1D = DDR1 2D = DDR2 |
| XXXX | Module Density | nnnK = nnn kilobit nnnM = nnn Megabit nnnG = nnn Gigabit nnnT = nnn Terabit |
| XX | Module Data Bit | 04 = x4 bit 08 = x8 bit 16 = x16 bit 32 = x32 bit 40 = x40 bit 48 = x48 bit 64 = x64 bit nn = xnn bit |
| X | Module Voltage | C = 5.0 V V = 3.3V S = 2.8V T = 2.5V U = 1.8V |
| X | Module Package | B = BGA C = Connector J = QFJ P = PGA Q = QFP S = SOP W = Wire Bond |
| X | Stacked Layers | 1 = 1 layer 2 = 2 layers 4 = 4 layers 8 = 8 layers n = n layers A = 10 layers |
| XXX | Control Features / Flayer Reference | nnn = Product flayer number |
| X | Temperature Range | C = 0°C to 70°C I = -40°C to 85°C M = -55°C to 125°C S = Specific |
| X | Quality Level | N = Commercial grade B = Industrial grade S = Space grade C = Custom |
| X | Space Screening Option | Blank = ESA qualified (quality grade for space applications ECSS-Q-60-05C) P = NASA PEM selection (screening and qualification PEM-INST-001) |
| X | Radiation Assurance | R = Radiation data tested A = Generic radiation data available - = Not applicable |
| XX | Speed / Access Time | 00 = N/A SRAM 10 = 10 ns 12 = 12 ns 15 = 15 ns 20 = 20 ns MRAM 35 = 35 ns FRAM 60 = 60 ns SDRAM 50 = 5 ns 55 = 5.5 ns 60 = 6 ns 70 = 7 ns 75 = 7.5 ns 80 = 8 ns DDR - first digit: 5 = 500 MHz 6 = 166 MHz 7 = 133 MHz 8 = 100 MHz - second digit: C = CL = 3 B = CL = 2.5 A = CL = 2 DDR2 - first digit 4 = DDR2-400 (200 MHz) 5 = DDR2-533 (266 MHz) 6 = DDR2-667 (333 MHz) 8 = DDR2-800 (400 MHz) - second digit: A = CL = 3, tRCD = 3, tRP = 3 C = CL = 4, tRCD = 4, tRP = 4 E = CL = 5, tRCD = 5, tRP = 5 G = CL = 6, tRCD = 6, tRP = 6 FLASH 03 = 30 ns 05 = 50 ns 07 = 70 ns 08 = 80 ns 09 = 90 ns 10 = 100 ns 11 = 110 ns 12 = 120 ns 25 = 25 ns 35 = 35 ns |
| X | Module Option | Blank = No option A = ARATHANE finish E = EPOTEK 302-3M H = Hermetic package M = MAPSIL finish T = Tantalum shielding W = WALOPACK shieldeng X = XV501T4 finish solder |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeHive204AP | adapter/module: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935) |
| BeeHive208S | adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeHive304 | adapter/module: AP3 TSOP50 module 3D Plus NAND-1a (73-3729A) |
| BeeProg2 | adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeProg2AP | adapter/module: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935) |
| BeeProg2C | adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeProg3 | adapter/module: AP3 TSOP50 module 3D Plus NAND-1a (73-3729A) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935) |
